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It is suitable for transistors, RDRAMTM, CD-ROM, CPU, pipeline equipment, and any products that need filling and cooling. Such as: high power tube, thyristor, inverter, high frequency microprocessor, notebook and desktop computer, audio and video equipment, LED lighting products, thermoelectric cooling device, temperature regulator and assembly table, power resistor and base Various heat sinks, such as between semiconductors and heat sinks, between CPUs and heat sinks. This product forms a very good heat conduction channel between sensitive electronic components and heat dissipation substrates, which reduces the device operating temperature below the critical point. Greatly extend component life.
