Whether it is a mobile phone or a computer, or even an electric car, all kinds of electronic products or mechanical equipment driven by electric energy will generate heat during use, which is unavoidable, and air is a poor conductor of heat, so the heat cannot It is quickly conducted to the outside through the air, causing the local temperature to rise and affecting the operation of the equipment.
Power consumption electronic components are the main heat source of electronic products or mechanical equipment, and the higher the power of electronic components, the more heat they generate. In addition to the use of heat dissipation devices, thermal interface materials are also essential. Microscopically, it can be observed that there is a gap between the heat dissipation device and the heat source, and an effective heat conduction channel cannot be formed between the two, and the heat dissipation effect of the device will not meet expectations.
サーマルインターフェース材料 is a general term for materials that are coated between the heating device and the cooling device of the equipment and reduce the contact thermal resistance between the two. The thermal interface material can fully fill the gap between the heating device and the cooling device, and eliminate the air in the gap to maximize The contact thermal resistance between the two is reduced, so that heat can be quickly conducted to the heat dissipation device through the thermal interface material, thereby reducing the temperature of the heat source.