.png)
.png)
.png)
.png)
.png)
.png)
.png)
.png)
.png)
To request a sample of our two-component (2K) Thermal Gel (Thermal Liquid Gap Filler) or inquire about more product information, please email us at [メール保護] or ここをクリック.
◆ Power Supply Units (PSUs)
◆ LED Modules
◆ Engine Control Units (ECUs)
◆ Gaming Consoles and Laptops
Dongguan Sheen Electronic Technology Co., Ltd.
◆ Founded: 2008
◆ Team: 110 employees
◆ Facility: 5,000㎡
◆ Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016
製品の説明
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, available in options ranging from 2.5 to 8.0 W/m·K.
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.
◆ Excellent flame resistance, achieving a UL94 V-0 rating.
◆ Curing time adjustable based on temperature.
◆ Two-component structure for easy storage.
◆ Can be precisely controlled for thickness and shape using automated equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, available in options ranging from 2.5 to 8.0 W/m·K.
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.
◆ Excellent flame resistance, achieving a UL94 V-0 rating.
◆ Curing time adjustable based on temperature.
◆ Two-component structure for easy storage.
◆ Can be precisely controlled for thickness and shape using automated equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
【アプリケーション】
◆ CPUs and GPUs◆ Power Supply Units (PSUs)
◆ LED Modules
◆ Engine Control Units (ECUs)
◆ Gaming Consoles and Laptops
プロパティ
| プロパティ | 単位 | SE250AB | 試験方法 |
|---|---|---|---|
| 熱伝導率 | W/m・K | 2.5 | ASTM D5470の |
| 流量(@50cc,90psi) | g/分 | 50±10 | - |
| 硬化前の色 | - | パートA:ホワイト パートB:ピンク | ビジュアル |
| 硬化前の粘度 | mPa.sの | パートA:250000 パートB:250000 | ASTM D2196の |
| 密度 | g/cc | 2.8 | ヘリウムピクノメトリー |
| ミックスレシオ | - | 1:1 | - |
| 硬化後の色 | - | ピンク | ビジュアル |
| 硬化後の硬度 | ショア00 | 55±10 | ASTM D2240の |
| タックフリータイム(@25°C) | 分 | 30 | - |
| フルキュアタイム(@25°C) | h | 4 | - |
| フルキュアタイム(@100°C) | 分 | 15 | - |
| 最小インターフェース厚さ | ミリメートル | 0.10 | - |
| 賞味期限(@25°C) | 月 | 6 | - |
| 動作温度 | °C°C | -50~150 | - |
| 絶縁耐力 (@AC) | kV/mm | >3 | ASTM D149の |
| 誘電率 (@1MHz) | - | 4.5 | ASTM D150 |
| 体積抵抗率 | Ω・cm | >1013 | ASTM D257 |
| 熱膨張係数 | ppm/K | 175 | ASTM E831 |
| シロキサン揮発性物質含有量(D3~D12) | ppmの | GB / T 27843-2011 | |
| フレームレーティング | - | V-0 | UL94の |
| RoHS指令 | - | 通る | IEC 62321 (英語) |
| ハロゲン | - | 通る | EN 14582 (英語) |
| 達する | - | 通る | EN 14372 (英語) |
我々について
◆ Founded: 2008
◆ Team: 110 employees
◆ Facility: 5,000㎡
◆ Focus: R&D and production of functional materials
◆ Strengths: Efficient, collaborative team
◆ Achievements: Key supplier to leading global manufacturers
◆ Applications: Telecom, Automotive, Medical, Computing, Industrial , Military
◆ Certifications: ISO9001:2015, ISO14001:2015, IATF16949:2016
パートナー
認証
