製品の説明
3611B-09 Patch SMT red glue is a one-component,high-temperature, fast-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards.Safe to use and meet environmental requirements.
| I.硬化前の材料特性 | ||
| アイテム | パラメーター | 試験方法 |
| 色 | 赤い | 視覚 |
| 降伏値(25°C、Pa) | 620 | *** |
| 比重(25°C、g / cm3) | 1.36 ± 0.2 | *** |
| 粘度(25°C、cps) | 550,000 ± 10% | *** |
| チキソトロピー指数 | 6.5~7.5 | *** |
| 引火点(TCC) | > 95 °C | *** |
| 粒子サイズ | *** | |
| 銅鏡面腐食 | 腐食なし | 視覚 |
使用方法と注意事項
1. The 3611B-09 stored in the store needs to be warmed before use. Under the environment of 25 ° C, the normal temperature of 30ml is 2-4 hours, and the temperature of 200-300ml is 4-6 hours.
Precautions:
(1) To avoid contamination of unused glue, do not return any glue to the original packaging.
(2) Glue solution is barely placed in the air, it will absorb trace moisture and affect performance, so it should be avoided as much as possible. When printing on stencils, please do not leave the printed circuit board in the air for too long. It should be cured as soon as possible. If necessary, the humidity of the air should be controlled.
(3) If in a non-standard conventional environment: 25 ° C, please completely thaw according to the specific environment. Do not quickly thaw the glue by heating.
Precautions:
(1) To avoid contamination of unused glue, do not return any glue to the original packaging.
(2) Glue solution is barely placed in the air, it will absorb trace moisture and affect performance, so it should be avoided as much as possible. When printing on stencils, please do not leave the printed circuit board in the air for too long. It should be cured as soon as possible. If necessary, the humidity of the air should be controlled.
(3) If in a non-standard conventional environment: 25 ° C, please completely thaw according to the specific environment. Do not quickly thaw the glue by heating.
硬化条件試験
The saved curing curve is shown below：
The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below.：
In the actual production process, the entire heating time is longer than the figure, because there is a preheating time.
The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below.：
In the actual production process, the entire heating time is longer than the figure, because there is a preheating time.
性能と特性
| アイテム | パラメーター | 試験方法 |
| 密度(25°C、g / cm3) | 1.36±0.1 | 視覚 |
| 熱膨張係数(um / m /°C) | a1 : | ASTM E831-86 |
| 熱伝導率WM-1。K-1 | A2 : > Tg 160 | ASTM C177 |
| 比熱 KJ.Kg-1.K-1 | 0.25 | *** |
| ガラス転移温度(°C) | 105-110 | *** |
| 誘電率 | 112 | *** |
| 誘電正接 | 3.8(100KHz) | *** |
| 体積抵抗率 | 2.1*1015Ω.センチメートル | ASTM D257 |
| 表面抵抗率 | 2.1*1015Ω.センチメートル | ASTM D257 |
| 電気化学的腐食 | AN-1.2 | ディン 53489 |
| せん断強度(低炭素鋼板の吹き付け)N/mm | 26 | ASTMD1002 |
| 引き抜き強度N(C-1206、FR4ベア基板) | 63 | |
| トルク強度 N.mm(C-1206、FR4ベア基板) | 51 |
特性と特性
Test method: ISO 4587 / ASTM D1002 shear strength
Test material: GBMS shear test piece
Curing method: curing at 150 ℃ for 30 minutes
Test material: GBMS shear test piece
Curing method: curing at 150 ℃ for 30 minutes
固体耐薬品性/溶剤性能
耐熱はんだ含浸
【保管・輸送】涼しく乾燥した場所に2〜8°Cの温度で6ヶ月間保管してください【パッケージ】お客様のニーズに合わせてカスタマイズされたパッケージ【有効期限】本製品の有効期限は6ヶ月です【安全性】「製品安全性能データ」(MSDS)をご参照ください。
