The main heat source of the brain is the central processing unit. Under normal circumstances, a radiator is installed on the central processing unit to guide heat to the radiator. However, the internal space such as mobile phones, chargers, tablets, etc. is extremely narrow. The product cannot install the radiator above the heat source, so it can only achieve the effect of heat dissipation by guiding the heat to the shell. However, there is a gap between the heat source and the heat dissipation shell, and the air is a poor conductor of heat, so the heat transfer efficiency is reduced, and the heat dissipation effect is poor.
In order to effectively improve the heat transfer efficiency and ensure that the product can run for a long time, it is necessary to use 熱伝導性材料. Fill the thermal conductive material between the heat source and the shell, fill the gap between the gaps, and eliminate the air between the gaps, reduce the contact thermal resistance, and improve the heat transfer efficiency, so that the heat can be transferred to the shell through the thermal conductive material to achieve heat dissipation. Effect, and guarantee the performance and reliability of its products.
