The most common cooling method is to install a heat sink on the surface of the heat source in the device, and guide the excess heat of the heat source to the heat sink, thereby reducing the temperature of the device, because air is a poor conductor of heat and there is a gap between the heat sink and the heat source. , when the heat is transferred between the two, the resistance given by the air will affect the heat dissipation effect.
In order to solve this problem, people fill a material called a 熱伝導材料 between the radiator and the heat source. There are many types of heat dissipation interface materials. Common heat dissipation interface materials such as thermal conductive silicone grease, thermal conductive silicone sheet, and silicon-free Thermally conductive gaskets, thermally conductive phase change sheets, thermally conductive insulating sheets, thermally conductive gels, thermally conductive wave absorbing materials, carbon fiber thermally conductive gaskets, etc. Of course, the thermal interface materials are more than these, and some specific environments use thermal interface materials.
The function of the 熱伝導材料 is to fill the gap in the required interface and remove the air in the gap, thereby reducing the contact thermal resistance between the two, thereby improving the heat conduction efficiency, thereby improving the heat transfer rate between the heat source and the heat sink. Auxiliary materials, but its role is very important. With the development of science and technology, the power of equipment is getting higher and higher, and the demand for heat dissipation is also higher, which makes the application range of 熱伝導材料 wider.