電子部品の放熱要件と熱伝導材料の応用

Temperature has a great impact on electronic components. For example, mobile phones freeze due to high temperature, hosts black screen due to high temperature, and servers cannot normally enter the company’s website due to high temperature. The heat conduction effect in the air is very poor, so electronic components are easy to It is accumulated on the surface of the component, so it is necessary to use a heat sink to dissipate heat.

A common heat dissipation device is a heat dissipation and cooling system composed of heat pipes, heat sinks, and fans. The contact piece of the heat pipe contacts the electronic component, conducts heat to the contact piece of the heat pipe, and then conducts it to the outside, thereby rapidly reducing the temperature of the electronic component. In addition to the use of heat dissipation devices, the use of 熱伝導性材料is also essential.

There is a gap between the electronic component and the heat sink. When the heat is conducted, it will be resisted by the air to reduce the conduction rate. The 熱伝導性材料 is a general term for materials that are coated between the heat generating device and the heat sink and reduce the contact thermal resistance between the two. After using the 熱伝導性材料, the gap between the two can be effectively filled and the air in the gap can be removed, thereby improving the operating environment of the electronic components.