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  • 電子製品の熱マネジメントと熱伝導性材料の応用

    日付:2023-02-17

    Heat generation during the operation of electronic products is unavoidable, and the development trend of miniaturization and light weight means that the internal space utilization rate of electronic products is higher, and the heat is not easy to dissipate outside after generation, so thermal management is in the development and design of electronic products Appears to be important.

    Excessive temperature is a bad thing for electronic products. Excessive temperature can easily cause electronic products to fail, and high temperature environment will accelerate the aging speed of electronic product materials. If it is serious, it may lead to spontaneous combustion of electronic products.


    熱伝導性材料 is a material specially used to deal with the heat conduction problem of equipment. There is a gap between the heat source and the heat dissipation device in the electronic product. The function is that it can be applied between the heat source and the heat dissipation device to remove the air in the gap, reduce the contact thermal resistance between the two, and improve the heat dissipation effect.

    There are many types of electronic products, each of which has a different internal structure, and there are many types of 熱伝導性材料, such as thermally conductive silica gel, thermally conductive gel, thermally conductive silicone grease, thermally conductive silicone cloth, thermally conductive phase change film, carbon fiber Thermal pads, silicon-free thermal pads, etc., and some relatively special applications require the use of some special thermal materials.

    Although 熱伝導性材料 only account for a small part of electronic products, their role cannot be underestimated. 熱伝導性材料 can effectively improve the heat dissipation efficiency of electronic products, thereby ensuring the normal operation of equipment.
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