As the support body of electronic components in electronic equipment, PCB board is the carrier for electrical interconnection of electronic components. The main body of electronic equipment heating is some electronic components of power consumption. Electronic components are assembled on PCB board, and the waste heat generated by heat source is very It is easy to accumulate and increase the temperature of the PCB board, which affects the operation of the system.
Heat dissipation devices such as heat dissipation fans, heat sinks, and heat pipes guide the heat from the surface of the heat source into the heat dissipation device, thereby reducing the temperature of the heat source. However, in thermal management, there are gaps between planes, and heat is conducted from the heat source to the heat sink. When cooling the device, it will be hindered and affect the speed, so a thermal interface material will be used to fill the interface gap.
Thermal interface material is a general term for materials that are coated between heating devices and heat dissipation devices and reduce the thermal resistance of interface contact. There are many types of 熱伝導材料, such as silicon-free thermal pads, thermal phase change sheets, thermal gels, thermal silicon Grease, carbon fiber thermal pad, thermal silica gel sheet, thermal phase change film, etc. The above-mentioned thermal interface materials are common in people's life and work. Some thermal interface materials have relatively complicated application environments, and the thermal interface materials used are also different. There are many heat sources on the PCB board, so there are many thermal interface materials used, and the application range is very wide.
