Power consumption electronic components are the main body of heat generation of electronic equipment. The higher the power, the more heat it will generate, and the air is a poor conductor of heat, so it is not easy to dissipate the heat after it is generated. The accumulation of heat makes the electronic equipment The local temperature rises, affecting the operation of the system.
Installing the radiator on the surface of the heat source is a commonly used heat dissipation method at present. The excess heat is conducted to the radiator through face-to-face heat conduction, and then the radiator guides the heat to the outside, thereby realizing the effect of heat dissipation.
Although the two planes seem to be seamless, there are still a large number of uncontacted areas. When the heat is transferred from the heat source to the radiator, it will be resisted by the air, so the heat conduction speed will be reduced, which will affect the heat dissipation effect. The role of the heat conduction material is It can be applied between the heat-generating device and the heat-dissipating device to remove the air in the gap and reduce the contact thermal resistance between the two, thereby increasing the speed of heat conduction between the two.
熱伝導性シリコーンシート is one of many thermally conductive materials. 熱伝導性シリコーンシート is a gap-filling gasket made of silicone oil as the base material and added with heat-conducting, insulating, and temperature-resistant materials. Thermally conductive silicone sheet has high thermal conductivity and low thermal conductivity. Interface thermal resistance, insulation, compressibility, etc., because the 熱伝導性シリコーンシート is soft, it can show a small thermal resistance under low pressure, and at the same time exclude the air between the contact surfaces and fully fill the gap between the contact surfaces The rough surface improves the heat conduction effect of the contact surface.