Heat generation is inevitable when the mobile phone is running, and the high temperature causes the mobile phone system to freeze and the battery life of the mobile phone is depleted, especially when playing games, the impact of high temperature on the mobile phone is more obvious. Mobile phone manufacturers are also working hard to try various cooling solutions, hoping to minimize the heat generation of mobile phones.
The cooling system composed of heat pipes, heat sinks, and fans is currently the most commonly used cooling method for equipment. However, due to the limited size of mobile phones, it is difficult to install large components such as fans in mobile phones. Heat dissipation on the back.
熱伝導性界面材料 is a material commonly used to deal with heat conduction problems in electronic equipment, such as thermally conductive silicone grease, thermally conductive gel, thermally conductive silicone sheet, etc. The contact area between the two is not much, and there are still a large number of uncontacted areas. The heat conduction between the heat source and the heat dissipation component will be resisted by the air, so the function of the thermal interface material is to effectively reduce the contact thermal resistance between the two and eliminate the gap. Inner air, thereby improving the heat dissipation effect of 5G mobile phones.
