Thermal conductive interface material is the general name of the material coated between the heating device and the heat dissipation device and reduce the thermal contact resistance between the two. Thermal conductive interface material can fill the gap between the heating device and the heat dissipation device, eliminate the air in the gap, so as to reduce the thermal contact resistance between the two and improve the heat transfer efficiency.
Thermal conductive silicone pad is one of the thermal conductive interface materials, thermal conductive silicone pad is also one of the most commonly used thermal conductive interface materials on the market at present. Thermal conductive silicone pad is based on silicone oil as the base material, proportional to add heat, temperature resistance, insulation materials for refining thermal conductive gaskets, with high thermal conductivity, low interface thermal resistance characteristics, and thermal conductive silicone pad soft and elastic, easy to rework.
ノンシリコンサーマルパッド is a member of the thermal conductivity interface material, the difference between it and the thermal conductive silicone sheet is that it does not contain silicone oil, can avoid the small molecules of siloxane precipitation in the application process, thus polluting the equipment parts, for some industry applications with special requirements have a good space for development, such as sensitive silicon equipment, high precision instruments, industrial cameras and so on. The non-silicon thermal conductive gasket is used in a similar way to the thermal conductive silicone sheet, so it is very convenient to use.
