なぜ熱抵抗の低い熱伝導性材料を探すのですか?

The internal space of electronic products is relatively sealed, and air is a poor conductor of heat, so the heat is not easy to dissipate outside in electronic products, making the local temperature too high, and the aging speed of materials at high temperatures is accelerated and the failure rate of electronic products is increased. So heat dissipation is a must.

The use of heat dissipation devices is the mainstream heat dissipation method. The heat from the surface of the heat source is guided into the heat sink through the contact piece with the heat source, thereby reducing the temperature of the device. However, there is a gap between the contact piece and the heat source, and there is air in the gap, and when the heat is conducted between the two, the conduction speed will be reduced by the air, thereby affecting the heat dissipation effect.

熱伝導性材料is a general term for materials that are coated between heat-generating devices and heat-dissipating devices and reduce the contact thermal resistance between the two. Thermally conductive materials can fill interface gaps and remove air in the gaps, thereby reducing the contact thermal resistance between the two. Thermal conductivity is a parameter to measure the thermal conductivity of materials. The selection of thermal conductivity materials is not only based on thermal conductivity, but also the thermal resistance of thermal conductivity materials.

The thermal resistance of the 熱伝導性材料 will affect its thermal conductivity. For a heat-conducting material with high thermal resistance, if there is a lot of scale in the water pipe, the speed of water flowing into the water pipe will be blocked and the flow rate will be reduced. Therefore, the thermal resistance of the heat-conducting material is very important. To choose the thermal resistance low thermal conductivity material.