Power consumption electronic components are the main heat source in electronic products, and the higher the power of electronic components, the greater the heat production, the heat dissipation device will lead the excess heat in the heating device to the heat dissipation device, and then the heat conduction device to the outside, is the current mainstream heat dissipation method, in addition to the use of heat dissipation devices, thermal interface materials are also not less.
熱伝導性界面材料 is the general name of the material coated in the equipment heating device and heat dissipation foreground and reduce the thermal contact resistance between the two. Thermal conductive interface material can fill the gap in the gap, exclude the air in the gap, reduce the thermal contact resistance between the two, so as to improve the heat conduction rate between the heating device and heat dissipation device.
熱伝導性界面材料 is a more professional interface material, often acts on the inside of the equipment, so people do not often come into contact with it, but the thermal conductive interface material plays a very important role, for the normal operation of the equipment plays a very good auxiliary heat dissipation role.
