Although the heat-generating device and the heat-dissipating device seem to fit closely, in fact, there is still a large amount of uncontacted area between the two contact interfaces from a microscopic point of view, so a good heat flow channel cannot be formed, resulting in a decrease in the rate of heat conduction. Electronic products The heat dissipation effect is not good.
熱伝導性ゲル is a soft silicone resin thermally conductive gap filling material. Thermally conductive gel has high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. Thermally conductive gel is filled between the electronic components to be cooled and the heat sink/housing, etc., to make them in close contact, reduce thermal resistance, and quickly and effectively reduce the temperature of electronic components.
熱伝導性ゲル is one of many gap filling materials for thermally conductive materials. Thermally conductive gel can fully fill the gap between the contact interfaces and remove the air in the gap, thereby reducing the interface contact thermal resistance, so that heat can be quickly transferred to the radiator, thus ensuring Electronic products can run efficiently for a long time, and thermal conductive gel can be applied in automated production lines, so it has good applications in many fields.
