Most of the heat source in the equipment is its power consumption electronic components, so the higher the power of the electronic components, the greater the heat generated by them, and the applications such as 5G mobile phones and 5G communication base stations The heat is much greater than the previous generation of products, so the heat dissipation of the device affects its reliability.
Why are thermal conductive materials used in addition to heat dissipation devices? The main reason is that the heat dissipation device and the surface of the heat source are not completely bonded, and there is still a large amount of uncontacted area, so the heat will be affected by the air when it is conducted between the two, and the conduction rate will be reduced, so it will be filled with a heat-conducting material. Between the heat dissipation device and the heat source, remove the air in the gap and fill the pits in the gap, thereby reducing the contact thermal resistance between the two.
カーボンファイバー製サーマルパッド is a thermal pad made of carbon fiber silica gel. It acts between the power device and the radiator. By filling the gap between the two, the air is removed, so that the heat from the heat source can be accelerated to the heat sink. device, so as to ensure the service life and performance of the body. Because this product uses carbon fiber as raw material, its thermal conductivity can exceed that of copper, and it has good mechanical properties, electrical conductivity, and excellent thermal conductivity and radiation cooling capabilities.
For some equipment or electronic products with high heat dissipation requirements today, カーボンファイバーサーマルパッド with high thermal conductivity are used to effectively protect the normal operation of the equipment and improve its reliability.
